Ceka BondPREAT Corporation
Ceka Bond is an anaerobic adhesive that solves micro-unthreading problems in traditional threaded precision attachments, implant abutments and screws, and orthodontic cases, such as the Herbst appliance.
It is non-caustic, non-water soluble, and slow setting to allow the best possible solution to cases of minor unthreading.
Simply put a dab of Ceka Bond on the threads prior to threading into the receptor. Allow to set for 5 minutes before applying a load.